Waffle tip bonding tools are used in the semiconductor industry mainly for
ribbon and “lead to lead” bonding applications. Waffle tip tools provide several
advantages in these applications:
Improved Heat Dissipation: The waffle tip design enables better heat
dissipation during the wire bonding process.
Reduced Damage: The waffle tip design distributes the pressure more
evenly, reducing the risk of damaging delicate components or substrates
during the bonding process.
Longevity: The design of waffle tips can often contribute to a longer lifespan
for the bonding tool due to the more even distribution of wear and tear.
Versatility: Waffle tip bonding tools can often accommodate a range of wire
diameters and materials, making them versatile for various bonding
Quality of Bonds: The design of the waffle tip can lead to improved bond
quality, ensuring reliable and consistent connections.
Micro Point Pro Ltd (MPP) offers a wide range of waffle tools made of a variety
of materials including Tungsten carbide (WC), Titanium (TiC) carbide, and
special Ceramic compositions. Our tools are made with the most advanced
manufacturing techniques to guarantee best-in-class quality and consistency.