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IBOND5000-DUAL WIRE BONDER

The iBond5000 Dual is an advanced ball/wedge bonder used for process development, production, research or added manufacturing support.

Highlights:

  • Overall solution – machine, tools, application development, service
  • Silver, Gold and Platinum service plans
  • Trade-in options & Rental options
  • 24/7 Online Technical support
  • Customized wire bonding profiles

 

  • High yield and excellent repeatability for every bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Chip-on-Boards and more.
  • Easy conversion between wedge and ball configuration
  • Adjustable work holder height for added flexibility
  • Supports a wide range of wire and ribbon sizes

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