The iBond5000 Dual is an advanced ball/wedge bonder used for process development, production, research or added manufacturing support.
- Overall solution – machine, tools, application development, service
- Silver, Gold and Platinum service plans
- Trade-in options & Rental options
- 24/7 Online Technical support
- Customized wire bonding profiles
- High yield and excellent repeatability for every bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Chip-on-Boards and more.
- Easy conversion between wedge and ball configuration
- Adjustable work holder height for added flexibility
- Supports a wide range of wire and ribbon sizes