Wire Bonders (OEM)

For more than 40 years MPP is a leading provider of wire bonding machinery, wire bonding tools, consumable tools, 4 point probe heads, precise tools, and special coatings for the semiconductor and microelectronic device assembly industry.

The iBond5000 Series Bonders –iBoond 5000 Ball Bonder, iBoond 5000 Wedge Bonder, and iBoond i5000 Dual Bonder are our latest addition, which integrates legacy Mechanics with up-to-date electronics.

The MPP iBond5000 Wire Bonder series is based on the proven 4500 Series, the market leader for nearly a decade, and used mainly for Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

The system enables you, the user, to save and load profiles; it comes with factory preconfigured profiles to ease usage.

Our wire bonders added value:
  • Install base of 9000+ machines worldwide with a global service & support
  • Customized wire bonding profiles
  • Short delivery time
  • Availability of used & refurbished machines
  • Overall product-application-bonding tools support
  • Tailored purchase agreements (including Trade-In & Rental options)

IBond5000-Manual Wedge Wire Bonder

IBOND5000- DUAL BALL AND WEDGE WIRE BONDER

IBOND5000-BALL WIRE BONDER

MANUAL WIRE BONDER WORKHOLDERS