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IBOND5000-WEDGE WIRE BONDER

The iBond5000 Wedge is an advanced wedge bonder used for process development, production, research, or added manufacturing support.

Highlights:

  • Overall solution – machine, tools, application development, service
  • Silver, Gold, and Platinum service plans
  • Trade-in options & rental options
  • 24/7 Online Technical support
  • Customized wire bonding profiles
  • High yield and excellent repeatability for every bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Chip-on-Boards, and more.
  • Adjustable work holder height for added flexibility
  • Ergonomic design and easy to use

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