The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.
The MPP iBond5000 series integrates the proven MWB (Manual Wire Bonder) mechanical design with an advanced graphic user interface.
The iBond5000 main control board is based on Cortex A9 Dual-core CPU that runs at a speed of 1GHz, the operating system is Windows CE based and the system is controlled using a 7”
600X800 TFT touch screen.
The system enables you, the user, to save and load profiles; it comes with factory preconfigured profiles to ease usage
The MPP iBond5000 Wire Bonder series is based on the successful K&S 4500 manual wire boner series, the market leader for nearly a decade.
Key Features:
- Overall solution – machine, tools, application development, service
- Silver, Gold, and Platinum service plans
- Trade-in options & rental options
- 24/7 Online Technical support
- Customized wire bonding profiles
- High yield and excellent repeatability for every bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Chip-on-Boards, and more.
- Adjustable work holder height for added flexibility
- Ergonomic design and easy to use
