Die Collets and Pick and Place Tools

MPP will enable you to overcome your pick and place process challenges by offering: A wide variety of catalog designs covering most of your pick and place requirements Custom die collets and pick up tools designed for coping with special die geometries and other process limitations Professional engineering support focused on solving process challenges High […]


MPP uses a variety of materials including Metals for precise parts

MPP has developed technological capabilities to handle a variety of materials including Metals – ferrous metals/magnetic & non-magnetic metals/alloys etc. : The different kind of metals include: Aluminum Copper Brass Bronze Titanium & more Plastic – our focus is specifically on PEEK & VESPEL materials. Ceramic Composites: Alumina, Aluminium Oxide (Al2O3) Zirconia (ZrO2) Silicon Carbide […]


MPP is an expert when it comes to producing complex mechanical miniature parts with tight tolerances. We supply prototype development/small R&D volumes as well as high volume production components, assemblies and tools. Our precision capabilities & solutions include: Accurate grinding of a wide variety of materials down to micron level tolerances Milling and turning of parts […]


Fine wire wedge bonding tools- MPP Tools

With over 35 years of experience, MPP is a leading supplier of Wedges, Fine Wire Wedges, Ribbon Bonding Wedges, and TAB tools for the microelectronics backend assembly industry. MPP tools are compatible with all manual, semi-automatic, and automatic wedge bonder models. We deliver an unmatched tool-to-tool repeatability to ensure stable bonding results with high yields. […]


MPP is a leading manufacturer of Heavy Wire Wedges (HWW) and ribbon tools for large manufacturers of power devices for all types of applications, especially: Automotive, Electric Vehicle (EV), and Semiconductors. All is done in-house and by applying own-designed unique & efficient manufacturing processes, with best in class integrated QC & QA.les MPP to HWW […]


MPP specializes in the field of thin protective glasslike coatings obtained by a patented combination of advanced high voltage sputtering technology at low temperatures 30-150°C (Cold HV-Sputtering) which provides direct deposition of amorphous films. A variety of ceramic and metal coatings are available. Our “Cold HV-Sputtering” has been used successfully in various types of applications: microelectronics, […]


Solder Jet Balling (SJB) is a standard technology in hard disc drive manufacturing. SJB is also applied in other major applications such as cell phone camera assembly, wafer bumping and more. Micro Point is the market leader for SJB tools. We provide: Superior materials & tool specifications for extending the tool’s life Special designs to […]


MPP is a leading supplier of Four Point Probe (4PP) heads for measurement of resistivity on wafers and on thin conductive films with 40 years of experience and expertise. All the probe parts head assemblies (body, wiring and needles) are produced internally, on MPP’s own high precision customized equipment, and then assembled and tested in house. […]


Micro-Point Pro excels in the design and manufacture of various types of dispensing nozzles for customized applications. Our dispensing nozzles are designed for accurate dispensing of the glue onto the substrate which helps to prevent inconsistent epoxy problems like tailing, bridging, voids and insufficient epoxy coverage. This enables our customers to achieve superior dispensing performance. The complete set of nozzles […]

IBond5000-Manual Wedge Wire Bonder

The iBond5000-Wedge is an advanced wedge bonder used for process development, production, research, or added manufacturing support, iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more. The MPP iBond5000 series integrates the proven […]