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FOUR POINTS PROBES

四点探头 - 四点探头领先供应商 - MPP Tools

MPP is a leading supplier of Four Point Probe (4PP) heads for measurement of resistivity on wafers and on thin conductive films with 40 years of experience and expertise. All the probe parts head assemblies (body, wiring and needles) are produced internally, on MPP’s own high precision customized equipment, and then assembled and tested in house. […]

FLUID DISPENSING TOOLS

Fluid Dispensing tools- provided by MPP TOOLS

Micro-Point Pro excels in the design and manufacture of various types of dispensing nozzles for customized applications. Our dispensing nozzles are designed for accurate dispensing of the glue onto the substrate which helps to prevent inconsistent epoxy problems like tailing, bridging, voids and insufficient epoxy coverage. This enables our customers to achieve superior dispensing performance. The complete set of nozzles […]

IBond5000-Manual Wedge Wire Bonder

IBond5000-Manual Wedge Wire Bonder

The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more. The MPP iBond5000 […]

IBOND5000- DUAL BALL AND WEDGE WIRE BONDER

WIRE BONDER: IBOND5000 - DUAL BALL AND WEDGE - MPP TOOLS

The iBond5000 Dual ball and wedge wire bonder is an advanced convertible wedge and ball bonder used for process development, production, research, and supplemental manufacturing support. The iBond5000 Dual enables ball and wedge wire bonder fine aluminum and gold wire wedge or ribbon bonding utilizing a deep access wire feed system. For gold or copper […]

IBOND5000-BALL WIRE BONDER

IBOND5000-BALL WIRE BONDER

The iBond5000-Ball is an advanced ball bonder used for process development, production, research, or added manufacturing support, iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more. The MPP iBond5000 series integrates the proven […]

MANUAL WIRE BONDER WORKHOLDERS

manual wire bonder placeholders

MPP introduces its Workholder Catalog for Manual Wire Bonder Applications. This catalog offers our wide range of workholders for standard and customized applications, suitable for use with all types of manual bonders (MPP and other suppliers). The MPP Manual Wire Bonder department continues to develop advanced workholders designed to fit our customer’s specific application needs and requirements.

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